cLGA Land Grid Array Socket System - LGA Socketshttp://www.lgasockets.com/ics_amph1000.jpg

LGA Sockets collage

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Description

http://www.lgasockets.com/bullet.jpg The InterCon cLGA® land grid array socket system was designed to bring conventional connector material construction to a high performance, low cost socket design. [More...]

Reports

http://www.lgasockets.com/bullet.jpg Full qual report on the industry's only LGA socket system that is qualified to both the EIA-540BOAE and Telcordia GR-1217-CORE specs. [More...]

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News

http://www.lgasockets.com/bullet.jpg China and Taiwan Distribution - Jetronic Corporation, a major distributor of electronic components in China and Taiwan, is now the exclusive distributor of Amphenol InterCon Systems products in those countries.

Performance

http://www.lgasockets.com/bullet.jpg Mechanical Performance -
  
http://www.lgasockets.com/arrow.jpg Mechanical performance specifications
  
http://www.lgasockets.com/arrow.jpg Product specification
  
http://www.lgasockets.com/arrow.jpg Application specification
  
http://www.lgasockets.com/arrow.jpg Current rating
  
http://www.lgasockets.com/arrow.jpg Force/deflection data
  
http://www.lgasockets.com/arrow.jpg Deflection/resistance data

http://www.lgasockets.com/bullet.jpg Electrical Performance -
  
http://www.lgasockets.com/arrow.jpg High-speed electrical performance specs
  
http://www.lgasockets.com/arrow.jpg Full electrical characterization test report

Products

http://www.lgasockets.com/bullet.jpg High-speed, low cost, solderless, low profile solutions.

  
http://www.lgasockets.com/arrow.jpg Standard chip-to-board
  
http://www.lgasockets.com/arrow.jpg Application specific chip-to-board
  
http://www.lgasockets.com/arrow.jpg Board-to-board
  
http://www.lgasockets.com/arrow.jpg Flex-to-board

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The InterCon cLGA® socket is a low cost, high volume, high speed, fully qualified chip-to-board, board-to-board, and flex-to-board solution for land grid array applications. The patented1 product design uses a gold-over-nickel plated beryllium copper spring technology to guarantee long-term connector reliability and ruggedness during handling and use. The cLGA® socket is the only product qualified to both the EIA-540BOAE and Telcordia GR-1217-CORE specifications.

1 U.S. patent numbers 6,176,707 and 6,217,342. Other patents pending.



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