InterCon cLGA® socket is a low cost, high volume, high speed, fully
qualified chip-to-board, board-to-board, and flex-to-board solution for
land grid array applications. The patented1 product design uses
a gold-over-nickel plated beryllium copper spring technology to guarantee
long-term connector reliability and ruggedness during handling and use. The cLGA® socket is the only product
qualified to both the EIA-540BOAE and Telcordia GR-1217-CORE
1 U.S. patent numbers 6,176,707 and 6,217,342. Other patents
© 2008 Amphenol InterCon Systems, Inc.