cLGA Land Grid Array Socket System - LGA Sockets

LGA Sockets collage

Description The InterCon cLGA® land grid array socket system was designed to bring conventional connector material construction to a high performance, low cost socket design. [More...]

Reports Full qual report on the industry's only LGA socket system that is qualified to both the EIA-540BOAE and Telcordia GR-1217-CORE specs. [More...]


News China and Taiwan Distribution - Jetronic Corporation, a major distributor of electronic components in China and Taiwan, is now the exclusive distributor of Amphenol InterCon Systems products in those countries.

Performance Mechanical Performance - Mechanical performance specifications Product specification Application specification Current rating Force/deflection data Deflection/resistance data Electrical Performance - High-speed electrical performance specs Full electrical characterization test report

Products High-speed, low cost, solderless, low profile solutions. Standard chip-to-board Application specific chip-to-board Board-to-board Flex-to-board

The InterCon cLGA® socket is a low cost, high volume, high speed, fully qualified chip-to-board, board-to-board, and flex-to-board solution for land grid array applications. The patented1 product design uses a gold-over-nickel plated beryllium copper spring technology to guarantee long-term connector reliability and ruggedness during handling and use. The cLGA® socket is the only product qualified to both the EIA-540BOAE and Telcordia GR-1217-CORE specifications.

1 U.S. patent numbers 6,176,707 and 6,217,342. Other patents pending.

Copyright © 2008 Amphenol InterCon Systems, Inc.